首页> 外国专利> Method of integrated circuit isolation oxidizing walls of isolation slot, growing expitaxial layer over isolation slot, and oxidizing epitaxial layer over isolation slot

Method of integrated circuit isolation oxidizing walls of isolation slot, growing expitaxial layer over isolation slot, and oxidizing epitaxial layer over isolation slot

机译:集成电路隔离氧化隔离槽壁,在隔离槽上生长外延层,并在隔离槽上氧化外延层的方法

摘要

A process is disclosed for forming an isolation region in a substrate of an integrated circuit structure while minimizing the creation of stress in the substrate which comprises forming a first mask over a portion of the substrate where an isolation region is to be formed, forming an isolation slot in the substrate through an opening in the mask, oxidizing the walls of said isolation slot, removing the first mask, growing an epitaxial layer over the substrate which fills or covers the remainder of the isolation slot, forming a second mask over the epitaxial layer with an oversize opening therein over the isolation slot beneath the epitaxial layer, and oxidizing the exposed portion of the epitaxial layer through the opening in the second mask to form an oxide cap over the isolation slot which extends downwardly through the epitaxial layer to the oxide in the isolation slot.
机译:公开了一种用于在集成电路结构的基板中形成隔离区域同时最小化基板中应力的产生的方法,该方法包括在要形成隔离区域的基板的一部分上形成第一掩模,形成隔离。通过掩模中的开口在衬底上形成槽,氧化所述隔离槽的壁,去除第一掩模,在衬底上生长填充或覆盖隔离槽的其余部分的外延层,在外延层上形成第二掩模在外延层下方的隔离槽上方有一个过大的开口,并通过第二个掩模中的开口氧化外延层的暴露部分,从而在隔离槽上方形成氧化层,该氧化层向下延伸穿过外延层到达氧化物。隔离插槽。

著录项

  • 公开/公告号US4853344A

    专利类型

  • 公开/公告日1989-08-01

    原文格式PDF

  • 申请/专利权人 ADVANCED MICRO DEVICES INC.;

    申请/专利号US19880231452

  • 发明设计人 JOHAN A. DARMAWAN;

    申请日1988-08-12

  • 分类号H01L21/76;

  • 国家 US

  • 入库时间 2022-08-22 06:27:44

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