Gold plating bath without eletrolise and coating process without eletrolise for use of gold as a coating on a substrate of ceramics metallized not activated

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• 3. A bath of copper without eletrolise for the deposition of copper on a substrate.Process for the deposition of copper from a bath of copper without eletrolise on a substrate; etilenodinitrilo - Tetra - 2-propanol [P] . BR8400185A . 1984-08-21

  机译： 不含铜的铜浴，用于将铜沉积在基板上。 etilenodinitrilo-Tetra-2-丙醇

• 4. A bath of nickel coating, process for depositing on a substrate chemically nickel and process for the rejuvenation of an aqueous nickel bath without eletrolise [P] . BR8402817A . 1985-12-31

  机译： 镍镀液，化学沉积镍的方法以及不加油的水镍镀液的再生方法

• 5. Processes for application of coatings to copper, without eletrolise, a substrate, and solutions for use in same [P] . BR8304782A . 1984-04-10

  机译： 不含铜的涂料在铜上的涂覆方法，基材以及在其中使用的溶液

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