Paste containing electrically conducting powder to form conducting solid filler in cavity in ceramic substrate

• 1. 在半导体结构中形成经隔离有源区域、沟槽及导电线的方法以及包含其的半导体结构 [P] . 中国专利： CN102017073B . 2014.04.09
• 2. 在半导体结构中形成经隔离有源区域、沟槽及导电线的方法以及包含其的半导体结构 [P] . 中国专利： CN102017073A . 2011-04-13
• 3. PASTE CONTAINING ELECTRICALLY CONDUCTING POWDER TO FORM CONDUCTING SOLID FILLER IN CAVITY IN CERAMIC SUBSTRATE [P] . 英国专利： GB2075066B . 1984-01-25

  机译： 陶瓷基腔中含导电粉的糊状导电填充物

• 4. PASTE CONTAINING ELECTRICALLY CONDUCTING POWDER TO FORM CONDUCTING SOLID FILLER IN CAVITY IN CERAMIC SUBSTRATE [P] . 英国专利： GB2075066A . 1981-11-11

  机译： 陶瓷基腔中含导电粉的糊状导电填充物

• 5. Paste, containing an electrically conductive powder, for the formation of a conductive, solid filler in a cavity of a ceramic substrate [P] . 德国专利： DE3115556A1 . 1982-02-25

  机译： 包含导电粉末的糊状物，用于在陶瓷基板的空腔中形成导电的固体填料

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• 1. Structure,Electrical Conducting and Thermal Expansion Properties of Ln_(0.6)Sr_(0.4)Co_(0.8)Fe_(0.2)O_3(Ln=La,Pr,Nd,Sm)Ceramics [J] . 徐庆 . 武汉理工大学学报：材料科学英文版 . 2008,第3期
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