首页>
外国专利>
Epoxy! resin casting compsn. for embedding electronic components - contg. quartz particles and Gp=IV, GP=V, GP=VI or GP=VIII metal (oxide) particles as catalyst
Epoxy! resin casting compsn. for embedding electronic components - contg. quartz particles and Gp=IV, GP=V, GP=VI or GP=VIII metal (oxide) particles as catalyst
Epoxy resin casting compsn. contains catalyst particles of gp. IV, V, VI or VIII metal (oxides) and quartz particles. The quartz particles are pref. quartz flour treated with an epoxy organosilane. The resin may also contain sub-microscopic SiO2 particles with untreated quartz flour. The ratio of metal (oxide) particles to epoxy resin is 1 : 104 - 1 : 107. The compsn. is prepd. by mixing the resin and quartz and opt. the SiO2 in a mixer made of or contg. a gp. IV, V, VI or VIII metal until metal abrasion incorporates a sufficient amt. of metal into the compsn. Alternatively a metal or oxide powder may be added to the compsn. Suitable metals include Cr, Fe, Ni, Ti, V, Mo, Co and Pt and their oxides. The catalyst does not adversely effect electronic components esp. semiconductor elements embedded in the compsn.
展开▼
