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Copper-nickel resistive thin sheet - with micro-rough copper and nickel electroplate to improve adhesion to resin substrates
Copper-nickel resistive thin sheet - with micro-rough copper and nickel electroplate to improve adhesion to resin substrates
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机译：铜镍电阻薄板-带有微粗糙的铜和镍电镀层，可改善与树脂基材的粘合力
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摘要
A resistive thin sheet consists of a high resistivity cupronickel foil having on one of its furfaces a micor-rough electrodeposited film contg. Cu and Ni. The alloy is pref. 55 wt. % Cu and 45 wt. % and has resistivity 40-52 mu OMEGA cm-3. That of the electrodeposited film is higher. The sheet is used in the prodn. of printed resitances. The sheet bonds well to resin substrates and can be bonded to epoxy resin-impregnated glass fibre substrates without using an adhesive, such prods. being unaffected by organic solvent vapours.
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