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Semiconductor heat sink dipped in coolant - has roughened surface assisting boiling coolant bubble formation and flow
Semiconductor heat sink dipped in coolant - has roughened surface assisting boiling coolant bubble formation and flow
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机译：半导体散热器浸入冷却液中-表面粗糙，有助于沸腾冷却液的形成和流动
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摘要
The heat sink, together with the power semiconductor, is immersed in a non-conductive, low boiling point liquid coolant. It has a rough surface, obtained by sand blasting, knurling, casting etc., in order to enhance the formation of gas bubbles when the coolant is brought to boiling. The heat sink may have a cylindrical or cubical shape with a given number of vertical bores also enhancing the flow of both bubbles and coolant. Two heat sinks discs may be conected by brazed pins, or a one piece casting of identical geometry may be used. The heat sink is suitable to reduce power losses with resulting incrase of service life.
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