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Soldering circuit element to plate, esp. ceramic plate - with thick or thin film circuit by infrared heating from below avoids damage by excessive heating
Soldering circuit element to plate, esp. ceramic plate - with thick or thin film circuit by infrared heating from below avoids damage by excessive heating
Soldering resistors, capacitors, connecting lugs or other circuit elements to carrier plates with thick or thin film circuits is effected by placing the element with its contacts accurately aligned on the upper side of the horizontal plate and melting the solder at the required spots with thermal energy supplied below and passing through the plate, pref. using IR source(s). The plate pref. consists of a ceramic, esp. Al2O3 ceramic. The radiation density is pref. as uniform as possible. The process is simple, rational and suitable for automation and avoids the danger of damaging the elements by excessive heating.
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