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Process for compensating boundary charges in silicon thin layers epitaxially grown on a substrate

机译:补偿在衬底上外延生长的硅薄层中的边界电荷的方法

摘要

Process for compensating for the presence of boundary charges in semiconductor layers which are grown on a monocrystalline insulating substrate including the step of introducing doping atoms into the region of the boundary charges. The doping atoms can be introduced before any semiconductor has been deposited after a thin layer of the semiconductor has been epitaxially grown on the substrate, or after all of the epitaxial layer has been grown.
机译:补偿在单晶绝缘衬底上生长的半导体层中边界电荷的存在的方法,包括将掺杂原子引入边界电荷区域的步骤。可以在衬底上外延生长半导体薄层之后,或者在所有外延层都生长之后,在沉积任何半导体之前引入掺杂原子。

著录项

  • 公开/公告号US3909307A

    专利类型

  • 公开/公告日1975-09-30

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;

    申请/专利号US19740498476

  • 发明设计人 STEIN;KARL-ULRICH;

    申请日1974-08-19

  • 分类号H01L7/54;H01L7/36;

  • 国家 US

  • 入库时间 2022-08-23 03:26:13

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