COATING PRINTED CIRCUIT BOARDS WITH TIN OR TIN-LEAD ALLOY AND TIN-LEAD FLUOBORATE PLATING BATHS

• 1. 有机掺杂铅锡氟磷酸盐闪烁玻璃及其制备方法 [P] . 中国专利： CN100336754C . 2007.09.12
• 2. 有机掺杂铅锡氟磷酸盐闪烁玻璃及其制备方法 [P] . 中国专利： CN1587141A . 2005-03-02
• 3. Electrolytic bath for coating printed circuits - has heated tin-lead alloy liquid circulated over printed circuit board to coat copper conductors [P] . 法国专利： FR2312916B3 . 1978-12-29

  机译： 涂覆印刷电路的电解槽-将加热的锡铅合金液体在印刷电路板上循环以涂覆铜导体

• 4. Electrolytic bath for coating printed circuits - has heated tin-lead alloy liquid circulated over printed circuit board to coat copper conductors [P] . 法国专利： FR2312916A1 . 1976-12-24

  机译： 涂覆印刷电路的电解槽-将加热的锡铅合金液体在印刷电路板上循环以涂覆铜导体

• 5. Masking and electro-tinning printed circuit boards - giving long storage life, by plating solder eyes with tin or tin-lead alloy [P] . 德国专利： DE2324991A1 . 1974-12-05

  机译： 掩蔽和电镀锡印刷电路板-通过使用锡或锡铅合金电镀焊锡眼来延长存储寿命

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• 2. Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders [C] . Xiaofei He, Michael H. Azarian, Michael G. Pecht IPC apex expo . 2009
• 3. Harmonic vibration testing of electronic components attached to printed wiring boards with SAC305 and eutectic tin-lead solder. [D] . Paquette, Beth Miller. 2010
• 4. Titanium Powder Coating Using Metal 3D Printing: A Novel Coating Technology for Cobalt–Chromium Alloy Implants [O] . Seung Chan Kim, Woo Lam Jo, Yong Sik Kim, 2019
• 5. Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board. [O] . Takeshi MIURA, Masaru SEITA 1993
• 6. Qualification and Procurement of Two-Sided Printed Circuit Boards (Fused Tin-Lead or Gold Plated Finish) [R] . Winter, K. G. 1985

• 1. Study on the Direct Plating of the printed circuit board [J] . 杨维生 . 印制电路资讯 . 2003,第003期
• 2. Morphology and microstructure of rapidly solidified tin-lead alloy powders [J] . Xiang Qingchun ,Zhang Wei ,Qiu Keqiang . 中国铸造 . 2014,第005期
• 3. Solder joint geometry of tin-lead alloy and its application in electronic packaging [J] . 王国忠 ,朱其农 ,程兆年 . 中国有色金属学会会刊：英文版 . 1999,第4期
• 4. Influence of Rare Earths on the Directional Solidification Microstructure of Tin-Lead Eutectic Alloy [J] . 朱颖 ,方洪渊 ,钱乙余 . 稀土学报：英文版 . 1997,第3期
• 5. 高锡、铅、锑脱铜阳极泥中金、银和钯的硫代硫酸盐浸出研究 [C] . 徐斌 ,闵欣 ,李科 . 全国铅锌冶金与资源综合利用技术交流会 . 2017
• 6. 锡氟磷酸盐玻璃-聚合物杂化材料的流变行为研究 [A] . 杨静 . 2015