Aluminium-steel joint - by nickel plating aluminium silver soldering steel and soft soldering both parts

• 1. 一种利用超薄铝钢复合过渡接头搭接焊的方法 [P] . 中国专利： CN106513945A . 2017-03-22
• 2. 钢铝复合导电轨的焊结接头 [P] . 中国专利： CN102490626A . 2012-06-13
• 3. Aluminium-steel joint - by nickel plating aluminium silver soldering steel and soft soldering both parts [P] . 德国专利： DE2112630A1 . 1972-09-28

  机译： 铝钢接头-镀镍铝银焊钢和软焊两部分

• 4. Al-Si solder alloys and their application for hard soldering aluminium and aluminium-steel combinations [P] . 欧洲知识产权局专利： EP1842619A3 . 2008-08-27

  机译： Al-Si焊料合金及其在硬焊接铝和铝钢组合中的应用

• 5. Al-Si solder alloys and their application for hard soldering aluminium and aluminium-steel combinations [P] . 欧洲知识产权局专利： EP1842619A2 . 2007-10-10

  机译： Al-Si焊料合金及其在硬焊接铝和铝钢组合中的应用

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• 2. ZnO whiskers growth on the surface of Sn9 Zn/Cu solder joints in concentrator silicon solar cells solder layer [J] . Zhang Liang, Yang Fan, Zhong Sujuan 高技术通讯（英文版） . 2017,第003期
• 3. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际, 光华, 盛光敏, 中南大学学报（英文版） . 2016,第008期
• 4. Analysis of IMC evolution and nickel plating consumption of SAC305/Ni soldering joints [C] . Wang Jian-hua, Meng Gong-ge International Forum on Strategic Technology . 2013
• 5. Microstructural evolution of nickel-enhanced tin-copper solder joints on nickel-gold and immersion silver PCB finishes. [D] . Bowers, Trevor S. 2006
• 6. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, 2019
• 7. Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times [O] . Angela De Rose, Gabriele Mikolasch, Mathias Kamp, 2020

• 1. Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints [J] . Guo-qiang Wei ,Lei Wang ,Xin-qiang Peng . 矿物冶金与材料学报 . 2013,第009期
• 2. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际12 ,文光华1 ,盛光敏1 . 中南大学学报 . 2016,第008期
• 3. 铝/镀锌钢搅拌摩擦铆焊两种接头对比分析 [C] . 王希靖 ,张亚州 ,李经纬 . 第十八次全国焊接学术会议 . 2013
• 4. 电解铝阳极导杆铝—钢相位摩擦焊技术研究 [A] . 李经伟 . 2014