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Ultrasound Transducer Array Architecture And Method of Manufacture

机译:超声传感器阵列架构和制造方法

摘要

An ultrasound transducer array architecture and manufacturing method is provided. The method includes providing an ultrasonic transducer including a plurality of modules, each module including an ultrasonic transducer array and an application specific integrated circuit (ASIC), the ultrasonic transducer array and the ASIC electrically coupled to a flexible interconnect, the flexible interconnect coupled to a connector. The ASIC and flexible interconnect may be arranged such that each ultrasonic transducer array is directly adjacent to another ultrasonic transducer array. The ASIC may be electrically coupled to the flexible interconnect and the ASIC to the transducer array via a redistribution layer. Each of the plurality of modules may be a stack with the ultrasonic transducer array on the RDL and RDL on the ASIC, wherein the flexible interconnect extends laterally from a top surface of the ASIC and curves down to a bottom surface of the ASIC.
机译:提供超声换能器阵列架构和制造方法。该方法包括提供包括多个模块的超声换能器,每个模块包括超声换能器阵列和专用集成电路(ASIC),超声换能器阵列和ASIC电耦合到柔性互连,柔性互连耦合到柔性互连。连接器。可以布置ASIC和柔性互连,使得每个超声换能器阵列直接与另一超声波换能器阵列相邻。 ASIC可以通过再分配层电耦合到柔性互连和换能器阵列。多个模块中的每一个可以是具有在ASIC上的RDL和RDL上的超声换能器阵列的堆叠,其中柔性互连从ASIC的顶表面横向延伸并弯曲到ASIC的底表面。

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