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Dual pressure sensing module with a shared electrical substrate

机译:具有共用电基板的双压敏模块

摘要

A pressure sensing module for an electronic device includes a substrate and a module housing coupled to the substrate. The module housing defines a first chamber and a second chamber. The second chamber is separate from the first chamber. The first chamber is configured to connect to an environment around an electronic device. The second chamber is configured to connect to an internal volume of the housing of the electronic device. A first pressure sensing element is electrically coupled to the substrate and disposed in the first chamber and is operative to detect an external pressure around the electronic device. A second pressure sensing element is electrically coupled to the substrate and disposed in the second chamber and is operative to detect an internal pressure within the electronic device housing.
机译:用于电子设备的压力传感模块包括基板和耦合到基板的模块壳体。模块壳体限定第一腔室和第二腔室。第二腔室与第一腔室分开。第一腔室被配置为连接到电子设备周围的环境。第二腔室被配置为连接到电子设备的壳体的内部容积。第一压力传感元件电耦合到基板并设置在第一腔室中并且可操作以检测电子设备周围的外部压力。第二压力传感元件电耦合到基板并设置在第二腔室中,并且可操作以检测电子设备壳体内的内部压力。

著录项

  • 公开/公告号US10948372B2

    专利类型

  • 公开/公告日2021-03-16

    原文格式PDF

  • 申请/专利权人 APPLE INC.;

    申请/专利号US201816145708

  • 申请日2018-09-28

  • 分类号G01L19/14;B81B7;G01L9;G01L19;G01L9/06;

  • 国家 US

  • 入库时间 2022-08-24 17:43:08

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