首页> 外国专利> METHODS OF DETERMINING CORRECTIONS FOR A PATTERNING PROCESS, DEVICE MANUFACTURING METHOD, CONTROL SYSTEM FOR A LITHOGRAPHIC APPARATUS AND LITHOGRAPHIC APPARATUS

METHODS OF DETERMINING CORRECTIONS FOR A PATTERNING PROCESS, DEVICE MANUFACTURING METHOD, CONTROL SYSTEM FOR A LITHOGRAPHIC APPARATUS AND LITHOGRAPHIC APPARATUS

机译:确定图案化工艺,装置制造方法,光刻设备和光刻设备的控制系统的校正方法

摘要

A method of determining a correction for a process parameter related to a lithographic process, wherein the lithographic process includes a plurality of runs during each one of which a pattern is applied to one or more substrates. The method of determining includes obtaining pre-exposure metrology data describing a property of a substrate; obtaining post-exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning, based on the pre-exposure metrology data, a group membership status from one or more groups to the substrate; and determining the correction for the process parameter based on the group membership status and the post-exposure metrology data.
机译:一种确定与光刻过程相关的过程参数的校正的方法,其中光刻过程包括在每个中的多个延伸,其中图案被施加到一个或多个基板。确定方法包括获取描述基板的性质的预曝光计量数据;获得包括在一个或多个先前暴露的基板上执行的过程参数的一个或多个测量的曝光后计量数据;根据预曝光计量数据,将一个或多个组的组成员身份证明到基板;基于组成员身份和曝光后计量数据确定对过程参数的校正。

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