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System for separating silicon raw material chips

机译:分离硅原料芯片的系统

摘要

The present invention provides a system for sorting silicon raw material chips, comprising: a supply means 10 for pulverizing and supplying silicon raw materials; A sieve means connected to the downstream side of the supply means 10 and for discharging the raw material chips sorted by particle size: foreign matter removing means 40 connected to the downstream side of the sieve means and removing foreign substances from the raw material chips; And a control means (50) for controlling the supply means (10), the sheave means, and the foreign matter removing means (40) with a set algorithm. Accordingly, in producing silicon powder applied to a semiconductor device, a series of processes from crushing to selection are continuously processed to secure the quality and productivity required for mass production sites.
机译:本发明提供一种用于分类硅原料芯片的系统,包括:用于粉碎和供应硅原料的供应装置10;筛装置连接到供应装置10的下游侧并用于通过粒度排出的原料芯片:异物去除装置40连接到筛装置的下游侧并从原料芯片中除去异物;和控制装置(50)用设定算法控制供应装置(10),滑轮装置和异物去除装置(40)。因此,在将施加到半导体器件的硅粉末中,连续处理从破碎到选择的一系列过程,以确保批量生产位点所需的质量和生产率。

著录项

  • 公开/公告号KR20210033640A

    专利类型

  • 公开/公告日2021-03-29

    原文格式PDF

  • 申请/专利权人 주식회사 씨엠코이엔지;

    申请/专利号KR1020190115172

  • 发明设计人 조성천;

    申请日2019-09-19

  • 分类号B02C23/08;B02C25;B03C1/02;B07B1/28;B07B4;

  • 国家 KR

  • 入库时间 2022-08-24 17:57:44

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