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Guide rail grinding equipment, guide rail grinding method, and guide rail grinding equipment adjustment method

机译:导轨磨床,导轨磨削方法,导轨磨削设备调整方法

摘要

Provided are a guide rail grinding device capable of grinding a guide rail more stably, a method for grinding the guide rail, and a method for adjusting the guide rail grinding device. The guide rail grinding device (1a) includes a grinding unit (4) and a traveling support (3a). The grinding unit (4) has a grinding means. The grinding means contacts the surface to be ground of the guide rail (2) and grinds. The traveling support (3a) has a first holding means and a guiding means. The first holding means holds the grinding unit (4) so as to maintain a relative positional relationship with the grinding unit (4). The guiding means guides the grinding unit (4) while contacting the guide rail (2) so that the grinding unit (4) moves in the first direction along the surface to be ground. In the traveling support (3a), the first holding means is provided at the front end portion in front of the guiding means in the first direction.
机译:提供了一种能够更稳定地研磨导轨的导轨研磨装置,一种用于研磨导轨的方法,以及用于调节导轨研磨装置的方法。导轨研磨装置(1A)包括研磨单元(4)和行进支撑件(3A)。研磨单元(4)具有研磨装置。研磨装置接触导轨(2)和研磨的地面。行进支撑件(3a)具有第一保持装置和引导装置。第一保持装置保持研磨单元(4),以便与研磨单元(4)保持相对位置关系。引导装置在接触导轨(2)的同时引导研磨单元(4),使得研磨单元(4)沿着待接地的表面沿第一方向移动。在行进支撑件(3a)中,第一保持装置设置在引导装置的前端部分处于第一方向。

著录项

  • 公开/公告号JP6866962B1

    专利类型

  • 公开/公告日2021-04-28

    原文格式PDF

  • 申请/专利权人 三菱電機株式会社;

    申请/专利号JP20200567625

  • 发明设计人 廣田 和明;大木 克倫;小笠原 崇;

    申请日2020-03-12

  • 分类号B24B27;B24D5;B24D3/06;B66B7/02;

  • 国家 JP

  • 入库时间 2022-08-24 18:28:10

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