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MICRO-HEMISPHERICAL RESONATOR GYROSCOPE STRUCTURE, ASSEMBLY METHOD AND WAFER FIXTURE

机译：微半球谐振器陀螺仪结构，装配方法和晶圆夹具

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A wafer-level assembly method for a micro-hemispherical resonator gyroscope structure, a micro-hemispherical resonator gyroscope structure and a wafer fixture of a micro-hemispherical resonator structure. The wafer-level assembly method for a micro-hemispherical resonator gyroscope structure comprises: performing high-temperature softening deformation on separately manufactured glass sheets (8) and shaping same, forming a micro-hemispherical resonator structure (1) in the middle of each glass sheet (8), cutting two ends of each glass sheet (8) by means of laser cutting to form glass sheet positioning holes (9), and aligning and fixing a plurality of identical micro-hemispherical resonator structures (1) on a wafer fixture (10) by taking the glass sheet positioning holes (9) as reference positions, then performing operation by taking the wafer fixture (10) as a unit, completing subsequent processes of releasing, surface metallization, fixing with planar electrodes (2), separation from the wafer fixture (10) and cleaning of the micro-hemispherical resonator structures (1), so as to obtain micro-hemispherical resonator gyroscope structures driven by the planar electrodes (2) at the bottom. By means of the wafer-level assembly method for a micro-hemispherical resonator gyroscope structure, wafer-level assembly operation can be achieved by fixedly mounting a plurality of separately manufactured micro-hemispherical resonator structures (1) on the same wafer fixture (10), significantly reducing assembly errors of micro-hemispherical resonator gyroscope structures, and improving the stability, consistency and assembly efficiency of the process.

机译：微半球形谐振器陀螺仪结构的晶片级组装方法，微半球谐振器陀螺结构和微半球形谐振器结构的晶片夹具。微半球形谐振器陀螺仪结构的晶片级组装方法包括：在单独制造的玻璃板（8）上进行高温软化变形，并在每个玻璃的中间形成微半球谐振器结构（1）薄片（8），通过激光切割切割每个玻璃板（8）的两端，形成玻璃板定位孔（9），并在晶片夹具上对准和固定多个相同的微半球谐振器结构（1）（10）通过将玻璃板定位孔（9）作为参考位置，然后通过将晶片夹具（10）作为单元进行操作，完成随后的释放，表面金属化，用平面电极（2）固定的过程（2），分离从晶片夹具（10）和清洁微半球谐振器结构（1），从而获得由底部的平面电极（2）驱动的微半球谐振器陀螺结构。借助于用于微半球形谐振器陀螺仪结构的晶片级组装方法，可以通过固定地安装在同一晶片夹具（10）上固定地安装多个单独制造的微半球谐振器结构（1）来实现晶片级组装操作，大大减少了微半球谐振器陀螺结构的组装误差，提高了该方法的稳定性，一致性和组装效率。

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公开/公告号WO2021093454A1

专利类型
公开/公告日2021-05-20

原文格式PDF
申请/专利权人 NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY;
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申请/专利号WO2020CN115926
发明设计人 WU XUEZHONG;YUAN CHAO;NIE BAO;XIAO DINGBANG;XI XIANG;WU YULIE;HE HANHUI;SHI YAN;LU KUN;LI BIN;CHEN YIMO;
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申请日2020-09-17
分类号G01C19/5691;G01C19/5783;G01C25;
国家 CN
入库时间 2022-08-24 18:52:08

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