首页> 外国专利> INTEGRATED METHOD FOR SILICON OPTICAL ADAPTER PLATE AND THREE-DIMENSIONAL ARCHITECTURE AND FOR SURFACE ELECTRODE ION TRAP, SILICON OPTICAL DEVICE AND THREE-DIMENSIONAL ARCHITECTURE, INTEGRATED STRUCTURE AND THREE-DIMENSIONAL ARCHITECTURE

INTEGRATED METHOD FOR SILICON OPTICAL ADAPTER PLATE AND THREE-DIMENSIONAL ARCHITECTURE AND FOR SURFACE ELECTRODE ION TRAP, SILICON OPTICAL DEVICE AND THREE-DIMENSIONAL ARCHITECTURE, INTEGRATED STRUCTURE AND THREE-DIMENSIONAL ARCHITECTURE

机译:硅光学适配器板和三维架构的集成方法和表面电极离子阱,硅光学装置和三维架构,集成结构和三维架构

摘要

An integrated method for a silicon optical adapter adapter plate and a three-dimensional architecture, capable of making the chip encapsulation area smaller, and achieving a higher integration level, a smaller electrical signal delay and a higher bandwidth and speed, and an integrated method for a surface electrode ion trap, a silicon optical device and a three-dimensional architecture, an integrated structure and a three-dimensional architecture with a strong stability, miniaturization, versatility and expandability. The integration of the three-dimensional architecture is realized on the basis of the integration of a through-silicon via and a silicon optical device, so that the integrated chip area can be smaller and the integration level can be higher, and the formed three-dimensional architecture has a smaller electrical signal delay and a higher bandwidth and speed. The surface electrode ion trap is integrated with a silicon single-photon avalanche detector or a silicon-based germanium single-photon avalanche detector, a silicon grating and/or a silicon nitride grating and a through-silicon via. After being powered on, the surface electrode ion trap is used to capture ions and trap same in a certain range. A laser source is coupled to the silicon grating and/or the silicon nitride grating by using any coupling mode such as end-face coupling. The laser is emitted to the ions via the silicon grating and/or the silicon nitride grating on three orientations to complete addressing. The ions can undergo energy level transition after being excited by light. After energy level transition, the ions can radiate fluorescent light. The fluorescent light is detected by the silicon single-photon avalanche detector or the silicon-based germanium single-photon avalanche detector, and the detection of quantum bit information is finally completed.
机译:硅光学适配器适配器板和三维架构的集成方法,能够使芯片封装区域更小,实现更高的集成电路,较小的电信号延迟和更高的带宽和速度,以及用于的集成方法表面电极离子阱,硅光学装置和三维架构,集成结构和三维架构,具有强的稳定性,小型化,多功能性和可扩展性。基于硅通孔和硅光学装置的集成来实现三维架构的集成,使得集成芯片面积可以较小,积分水平可以更高,并且形成的三个 - 尺寸架构具有较小的电信号延迟和更高的带宽和速度。表面电极离子阱与硅单光子雪崩检测器或硅基锗单光子雪崩检测器,硅光栅和/或氮化硅光栅和通过硅通孔。在电源接通之后,表面电极离子阱用于捕获离子并在一定范围内捕获相同的捕获。通过使用诸如端面耦合的任何耦合模式,激光源耦合到硅光栅和/或氮化硅光栅。通过硅光栅和/或氮化硅光栅在三个方向上发射到离子以完成寻址。在通过光激发后,离子可以进行能量水平过渡。在能水位过渡后,离子可以辐射荧光。荧光灯由硅单光子雪崩检测器或硅基锗单光子雪崩检测器检测,并且最终完成量子位信息的检测。

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