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Joining device, joining system, joining method, and computer storage medium

机译:加入设备,加入系统,加入方法和计算机存储介质

摘要

To properly perform position adjustment on a first holding unit for holding a first substrate and a second holding unit for holding a second substrate and properly perform joint processing between the substrates.SOLUTION: A joint device for joining substrates to each other includes a first holding unit for suctioning and holding a first substrate on a lower surface by vacuuming, a second holding unit which is provided below the first holding unit and suctions and holds a second substrate by vacuuming, a rotating mechanism for relatively rotating the first holding unit and the second holding unit, a moving mechanism for relatively moving the first holding unit and the second holding unit in a horizontal direction, three position measuring units which are provided to the first holding unit or the second holding unit rotated by the rotating mechanism and measures the position of the first holding unit or the second holding unit, and a controller for controlling the rotating mechanism and the moving mechanism based on measurement results by the three position measuring units.SELECTED DRAWING: Figure 7
机译:为了适当地在用于保持第一基板的第一保持单元上进行位置调节,用于保持第一基板和用于保持第二基板的第二保持单元并适当地执行基板之间的联合处理。效果:用于彼此连接基板的接合装置包括第一保持单元用于通过真空吸尘在下表面上抽吸和保持第一基板,第二保持单元设置在第一保持单元和吸附下方并通过真空保持第二基板,旋转机构相对旋转第一保持单元和第二保持装置单元,用于在水平方向上相对移动第一保持单元和第二保持单元的移动机构,三个位置测量单元,其被提供给第一保持单元或第二保持单元通过旋转机构旋转并测量位置第一保持单元或第二保持单元,以及用于控制旋转机构的控制器基于测量结果的三个位置测量单元的移动机制。选择绘图:图7

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