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EFFICIENT GROUNDING OF ELECTRICAL CONNECTION WITH CHALLENGING BONDING PATH
EFFICIENT GROUNDING OF ELECTRICAL CONNECTION WITH CHALLENGING BONDING PATH
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机译：与具有挑战性的粘接路径有效接地
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摘要
A system and method of safely servicing a liquid-tight container installed in a location where flammable vapors or electrostatic shock exist, where the structure of the container is fabricated of a non-conductive material. The electrostatic charge build-up inside the container is achieved by coating the inside surface with a dissipative plastic and connecting the dissipative coating to a conductive feed-through with a metallic layer, where at least one of the metallic layer or the conductive layer extends over at least the region between a lower design fill level and an upper design fill level. The conductive feed-through is connected to a system static ground point which is isolated from electronic power supply grounds.
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