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SEMICONDUCTORS HAVING DIE PADS WITH ENVIRONMENTAL PROTECTION AND PROCESS OF MAKING SEMICONDUCTORS HAVING DIE PADS WITH ENVIRONMENTAL PROTECTION
SEMICONDUCTORS HAVING DIE PADS WITH ENVIRONMENTAL PROTECTION AND PROCESS OF MAKING SEMICONDUCTORS HAVING DIE PADS WITH ENVIRONMENTAL PROTECTION
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机译：具有芯片垫的半导体，具有环境保护和制造具有环保的模具垫的半导体的过程
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摘要
A process of forming a device with a pad structure having environmental protection includes providing a semiconductor body portion, arranging a pad on the semiconductor body portion, providing at least one environment encapsulation portion at least partially on the pad, arranging a supplemental pad on the pad, and arranging the supplemental pad to include side surfaces that extend vertically above the at least one environment encapsulation portion. A device having a pad structure having environmental protection is also disclosed.
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