首页> 外国专利> Resin for acoustic wave probe, resin material for acoustic wave probe, manufacturing method of resin material for acoustic wave probe, acoustic lens, acoustic wave probe, ultrasonic probe, acoustic wave measuring device, ultrasonic diagnostic apparatus, photoacoustic wave measuring apparatus and ultrasonic endoscope

Resin for acoustic wave probe, resin material for acoustic wave probe, manufacturing method of resin material for acoustic wave probe, acoustic lens, acoustic wave probe, ultrasonic probe, acoustic wave measuring device, ultrasonic diagnostic apparatus, photoacoustic wave measuring apparatus and ultrasonic endoscope

机译：用于声波探头的树脂，用于声波探头的树脂材料，隔音波树脂材料的制造方法，声透镜，声波探头，超声波探头，声波测量装置，超声波诊断装置，光声波测量装置和超声内窥镜

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摘要

To provide a resin for an acoustic wave probe and a resin material for an acoustic wave probe capable of providing, by being molded, a constituent member of an acoustic wave probe whose acoustic impedance is close to the value of a living body, the acoustic wave attenuation amount is reduced, and the chemical resistance is excellent, and a production method of the resin material for an acoustic wave probe, and to provide an acoustic lens, an acoustic wave probe, an ultrasonic probe, an acoustic wave measuring device, an ultrasonic diagnostic device, a photoacoustic wave measuring device, and an ultrasonic endoscope.SOLUTION: The resin material for an acoustic wave probe contains: a resin for an acoustic wave probe containing a specific vinyl polymer, a polysiloxane, an organic peroxide and/or a photo radical polymerization initiator; and a resin formed by bonding a specific vinyl polymer and polysiloxane to each other.SELECTED DRAWING: None

机译：为了提供用于声波探针的树脂和用于通过模制的声波探针提供声波探针的树脂材料，声波探针的构成构件，其声阻抗接近生物体的值，声波减少衰减量，耐化学性优异，以及用于声波探针的树脂材料的生产方法，并提供声透镜，声波探头，超声波探头，声波测量装置，超声波测量装置诊断装置，光声波测量装置和超声内窥镜。溶液：用于声波探针的树脂材料含有：用于声波探针的树脂，其含有特定的乙烯基聚合物，聚硅氧烷，有机过氧化物和/或照片自由基聚合引发剂;通过将特定的乙烯基聚合物和聚硅氧烷彼此粘合来形成的树脂。选择绘图：无

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公开/公告号JP6912270B2

专利类型
公开/公告日2021-08-04

原文格式PDF
申请/专利权人富士フイルム株式会社;
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申请/专利号JP20170097901
发明设计人中井義博;永田裕三;上平茂生;芳谷俊英;
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申请日2017-05-17
分类号H04R17;A61B8/14;H04R19;H04R1/34;G10K11/30;
国家 JP
入库时间 2022-08-24 20:19:41

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