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METHOD FOR PREPARING THE AUTOMATED PRODUCTION OF AN ELECTRONIC COMPONENT, METHOD FOR AUTOMATED PRODUCTION AND/OR FOR AUTOMATED POST-PROCESSING OF AN ELECTRONIC COMPONENT, COMPUTING DEVICE, COMPUTER PROGRAM AND ELECTRONICALLY READABLE DATA STORAGE DEVICE
METHOD FOR PREPARING THE AUTOMATED PRODUCTION OF AN ELECTRONIC COMPONENT, METHOD FOR AUTOMATED PRODUCTION AND/OR FOR AUTOMATED POST-PROCESSING OF AN ELECTRONIC COMPONENT, COMPUTING DEVICE, COMPUTER PROGRAM AND ELECTRONICALLY READABLE DATA STORAGE DEVICE
The invention relates to a method for preparing the automated production of an electronic component (5), in which method at least one SMD component (19) and/or at least one conductor track (18) are arranged on at least one substrate, for production by 3D printing, wherein structural information describing the structure of the electronic component, particularly created by a CAD and/or CAM device (9), is used to determine first production information comprising a first machine-readable control command set (1) for a production device (12), which is designed at least in part for 3D printing, wherein, together with the first control command set (1), post-processing information (4) is determined from the structural information and/or the production information, which comprises recycling information comprising a second, machine-readable control command set (2) for a recycling device (13) designed for an at least partial, particularly complete, automated recycling of the electronic component (5) by recovery of at least one material of the electronic component (5) and/or repair information comprising a third machine-readable control command set (3) for a repair device designed for an at least partial automatic repair of the electronic component (5), and is reserved for the post-processing, particularly the recycling of, and/or repair of the electronic component (5).
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