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EXHAUST VAPOR GAS PROCESSING SYSTEM OF SUBSTRATE OPERATION FOR HIGH TECHNOLOGY INDUSTRY AND LIQUEFING APPARATUS USED THEREFOR
EXHAUST VAPOR GAS PROCESSING SYSTEM OF SUBSTRATE OPERATION FOR HIGH TECHNOLOGY INDUSTRY AND LIQUEFING APPARATUS USED THEREFOR
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机译：用于高科技工业和液化装置的基板操作排气蒸汽气体处理系统
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摘要
The present invention includes: a vacuum pump in communication with a reaction chamber for processing a wafer and configured to pump exhaust vapor gas used for processing the wafer in the reaction chamber to the outside; and a housing communicating with them between the reaction chamber and the vacuum pump and allowing the exhaust vapor gas to pass therethrough, and liquefying the exhaust vapor gas at a temperature condition of -10°C to -40°C in the housing to generate an exhaust liquid a liquefaction module configured to; a collection module communicating with the housing and having an accommodating tank for accommodating the exhaust liquid flowing in from the housing; and a heat exchange line through which the refrigerant flows and extends into the housing to allow the refrigerant to exchange heat with the exhaust vapor gas under a temperature condition of -10°C to -40°C, wherein the heat exchange line connects the outside of the receiving tank Provided are an exhaust vapor gas processing system for a high-tech industrial substrate processing process, and a liquefaction processing apparatus used therein, including a chiller disposed to pass therethrough and configured to allow the refrigerant to also cool the exhaust liquid accommodated in the receiving tank.
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