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LOW INDUCTANCE LASER DRIVER PACKAGING USING LEAD-FRAME AND THIN DIELECTRIC LAYER MASK PAD DEFINITION
LOW INDUCTANCE LASER DRIVER PACKAGING USING LEAD-FRAME AND THIN DIELECTRIC LAYER MASK PAD DEFINITION
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机译：低电感激光驱动器包装使用引线和薄介电层掩模垫清晰度
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摘要
A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.
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