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JOINED BODY MANUFACTURING METHOD MULTILAYER JOINED BODY MANUFACTURING METHOD POWER-MODULE SUBSTRATE MANUFACTURING METHOD HEAT SINK EQUIPPED POWER-MODULE SUBSTRATE MANUFACTURING METHOD AND LAMINATED BODY MANUFACTURING DEVICE
JOINED BODY MANUFACTURING METHOD MULTILAYER JOINED BODY MANUFACTURING METHOD POWER-MODULE SUBSTRATE MANUFACTURING METHOD HEAT SINK EQUIPPED POWER-MODULE SUBSTRATE MANUFACTURING METHOD AND LAMINATED BODY MANUFACTURING DEVICE
(Project) A method for manufacturing a joined body that can efficiently manufacture these joined bodies by preventing misalignment of the joining surfaces of each member when joining metal plates or a metal plate and a ceramic plate, and applying this to a power module substrate A method of manufacturing a substrate for a power module is provided. (Solution means) A temporarily fixed material 40 having a saturated fatty acid as a main component is applied to either one of the copper circuit board (first member) 30 or the ceramic substrate (second member) 20, and the temporarily fixed material is melted ( 40) through which the copper circuit board 30 and the ceramic substrate 20 are laminated and positioned, and the laminated copper circuit board 30 and the ceramic substrate 20 are temporarily fixed by cooling the temporary fixing material 40 ( 80), and a bonding step of forming a bonded body in which the copper circuit board 30 and the ceramic substrate 20 are joined by pressing and heating the laminate 80 in the lamination direction.
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