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HOUSEHOLDS, HOUSEHOLDS AND PROCEDURES FOR ESTABLISHING HOUSEHOLDS

机译:家庭,家庭和建立家庭的程序

摘要

Case arrangement (100), comprising:a first encapsulation material (102);at least one electronic circuit (104) embedded in at least part of the first encapsulation material (102), with at least one electronic circuit (104) a first contact padding structure (104c) on a first page (104a) having at least one electronic circuit (104);at least one electromechanical component (106), which is positioned over the first side of at least one electronic circuit (104), with at least one electromechanical component (106) having a second contact padding structure (106c) indicating at least one electronic circuit (104);a redistribution layer assembly (108) between at least one electromechanical component (106) and at least one electronic circuit (104), where the redistribution layer assembly (108) electrically connects the first contact padding structure (104c) to the second contact padding structure (106c), with a gap (109) between at least one electromechanical component (106) and the redistribution layer assembly (108),where the redistribution layer structure (108) has a first redistribution layer (108a) that contacts the first contact padding structure (104c), and on the first redistribution layer (108a) a second redistribution layer (108b) that contacts the second contact padding structure (106c);a second encapsulation material (110), covering at least part of it at least one electromechanical component (106), the gap (109) being free of the second encapsulation material (110).
机译:壳体布置(100),包括:第一封装材料(102);至少一个电子电路(104),其嵌入第一封装材料(102)的至少一部分中,具有至少一个电子电路(104)第一触点在具有至少一个电子电路(104)的第一页面(104a)上的填充结构(104c);至少一个机电部件(106),其位于至少一个电子电路(104)的第一侧上,在至少一个机电部件(106),其具有第二接触衬垫结构(106c),其指示至少一个电子电路(104);在至少一个机电部件(106)和至少一个电子电路之间的再分配层组件(108)(108)(104 ),其中再分配层组件(108)将第一接触衬垫结构(104c)电连接到第二接触衬垫结构(106c),在至少一个机电部件(106)和再分布之间的间隙(109)和重新分配之间层组件(108),其中再分配层结构(108)具有与第一接触填充结构(104c)接触的第一再分布层(108a),以及在第一再分布层(108a)上的第二再分布层(108b)接触第二接触衬垫结构(106c);第二封装材料(110),覆盖至少一个机电部件(106)的至少一部分,间隙(109)不含第二封装材料(110)。

著录项

  • 公开/公告号DE102015116053B4

    专利类型

  • 公开/公告日2021-09-23

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE201510116053

  • 发明设计人 THOMAS KILGER;ULRICH WACHTER;

    申请日2015-09-23

  • 分类号H01L23/50;H01L21/60;

  • 国家 DE

  • 入库时间 2022-08-24 21:13:45

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