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How to create a chemical mechanical polishing system for workpieces, a computing system, and a simulation model for chemical mechanical polishing
How to create a chemical mechanical polishing system for workpieces, a computing system, and a simulation model for chemical mechanical polishing
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机译：如何为工件，计算系统和化学机械抛光模拟模型创建化学机械抛光系统
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摘要
PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing system capable of predicting the polishing result of a workpiece such as a wafer accurately and at high speed by using a physical model. A chemical mechanical polishing system includes a polishing device 1 for polishing a workpiece W and a calculation system 47. The arithmetic system 47 has a simulation model including at least a physical model that outputs an estimated polishing physical quantity including an estimated polishing rate of the workpiece W. The calculation system 47 inputs the polishing conditions of the workpiece W into the simulation model, outputs the estimated polishing physical quantity of the workpiece W from the simulation model, and brings the estimated polishing physical quantity closer to the measured polishing physical quantity of the workpiece W. Is configured to determine. [Selection diagram] Fig. 1
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