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UV LED UV LED ARRAY WITH POWER INTERCONNECT AND HEAT SINK

机译:UV LED UV LED阵列,带电源互连和散热器

摘要

A heat sink and power interconnect for the UV LED array are provided. The first circuit is disposed on the surface of the first substrate. A UV LED array is placed thereon. The second substrate and the second circuit are spaced apart from the first substrate, and a first heat sink is positioned adjacent thereto. The opening passes through each of the first substrate, the second substrate, and the heat sink. An electrical insulator lines the opening with an electrically and thermally conductive liner positioned adjacent the electrical insulator. A fastener is positioned within the opening and electrically interconnects the first circuit and the second circuit through an electrically and thermally conductive liner and is in electrical communication with an external power supply. The fasteners carry one or more of power or electrical signals and dissipate heat through the electrically and thermally conductive liners to the heat sink.
机译:提供了用于UV LED阵列的散热器和功率互连。 第一电路设置在第一基板的表面上。 UV LED阵列放置在其上。 第二基板和第二电路与第一基板间隔开,第一散热器位于其附近。 开口通过第一基板,第二基板和散热器中的每一个。 一种电绝缘体,其具有与电绝缘体相邻的电动和导热衬里的开口。 紧固件位于开口内,并将第一电路和第二电路电互连通过电和导热衬垫,并且与外部电源电连通。 紧固件携带电力或电信号中的一个或多个,并通过电和导热衬里散发到散热器。

著录项

  • 公开/公告号KR102292973B1

    专利类型

  • 公开/公告日2021-08-24

    原文格式PDF

  • 申请/专利权人 소울나노 리미티드;

    申请/专利号KR20190159574

  • 发明设计人 흐시에 흥 흐신;웡 조 항;

    申请日2019-12-04

  • 分类号H01L33/64;H01L23/14;H01L23/15;H01L27/15;H01L33/62;

  • 国家 KR

  • 入库时间 2022-08-24 22:18:36

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