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CURABLE THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION WITH INCREASED THIXOTROPIC INDEX

机译:可固化的导热聚硅氧烷组合物具有增加的触变指数

摘要

A composition contains: (a) a vinyl-functional polysiloxane; (b) a silyl hydride functional polysiloxane having on average at least two silyl hydride groups per molecule; (c) 60 to 92 weight-percent thermally conductive filler; (d) a platinum hydrosilylation catalyst; and (e) 0.05 to 2.0 weight-percent of a trialkoxy-functional polysiloxane; where the trialkoxy -functional polysiloxane has two or more trialkoxy functionalities per molecule and a number average molecular weight of 1200 or more and where weight-percents are relative to the composition weight.
机译:组合物含有:(a)乙烯基官能聚硅氧烷; (b)每分子具有平均至少两种甲硅烷基氢化物的氢化物纯官能聚硅氧烷; (c)60至92重量百分比的导热填料; (d)铂氢化硅烷化催化剂; (e)试验氧基官能聚硅氧烷的0.05至2.0重量%; 其中三烷氧基 - 官能聚硅氧烷具有每分子的两个或更多个三烷氧基官能团,数均分子量为1200或更大,其中重量百分比相对于组合物重量。

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