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VIA COUPLING STRUCTURES TO REDUCE CROSSTALK EFFECTS
VIA COUPLING STRUCTURES TO REDUCE CROSSTALK EFFECTS
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机译：通过耦合结构来减少串扰效应
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摘要
In one embodiment, an apparatus includes first and second via structures in a substrate. Each via structure defines a coupling element that extends from the via structure toward the other via structure such that the coupling elements capacitively couple with one another in an area between the first and second via structures.
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