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ASSEMBLY POWER-MODULE SUBSTRATE PROVIDED WITH HEAT SINK HEAT SINK METHOD FOR MANUFACTURING ASSEMBLY METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE PROVIDED WITH HEAT SINK AND METHOD FOR MANUFACTURING HEAT SINK
ASSEMBLY POWER-MODULE SUBSTRATE PROVIDED WITH HEAT SINK HEAT SINK METHOD FOR MANUFACTURING ASSEMBLY METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE PROVIDED WITH HEAT SINK AND METHOD FOR MANUFACTURING HEAT SINK
A joined body in which an aluminum member made of an aluminum alloy and a metal member made of copper, nickel or silver are joined, wherein the aluminum member is composed of an aluminum alloy whose solidus temperature is lower than the eutectic temperature of a metal element and aluminum constituting the metal member. A Ti layer is formed in the joint portion between the aluminum member and the metal member, and the aluminum member and the Ti layer, and the Ti layer and the metal member are respectively solid-state diffusion bonded.
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