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PROBE CARD FOR HIGH-TEMPERATURE HIGH-VOLTAGE TEST OF POWER DEVICE
PROBE CARD FOR HIGH-TEMPERATURE HIGH-VOLTAGE TEST OF POWER DEVICE
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机译：功耗高温高压试验探针卡
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摘要
A probe card for a high-temperature high-voltage test of a power device, relating to the technical field of semiconductor device tests. The probe card is sequentially provided with an air inlet system (1), a PCB (2), a transfer layer (3), a guide plate (4), and a probe (5) from top to bottom; a plurality of lower air outlets (1-1) and side air outlets (1-2) are formed at the bottom of the air inlet system (1); first through holes (2-1) having the same position, shape and number as the lower air outlet holes (1-1) are distributed on the PCB (2); second through holes (3-1) having the same position, shape and number as the lower air outlet holes (1-1) are distributed on the transfer layer (3); third through holes (4-1) having the same position, shape and number as the lower air outlet holes (1-1) are distributed on the guide plate (4); the lower air outlet holes (1-1), the first through holes (2-1), the second through holes (3-1), and the third through holes (4-1) are coaxially arranged; high-temperature high-pressure gas jetted from the lower air outlet holes (1-1) sequentially passes through the first through holes (2-1), the second through holes (3-1), and the third through holes (4-1) and then is blown between the guide plate (4) and a tested wafer (6). According to the present invention, abnormal discharge between the probes (5) in a high-voltage environment and buckling deformation of the probe card and position drift of the probe (5) in a high-temperature environment can be suppressed at the same time.
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