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POLICE ISSUES, POLICE REPORT AND PROCEDURES FOR POLICY OF SILIZIUM WARNS
POLICE ISSUES, POLICE REPORT AND PROCEDURES FOR POLICY OF SILIZIUM WARNS
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机译：警察问题，警方报告和硅化政策的程序警告
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摘要
The present invention provides for a polishing cushion, a polishing device and a polishing process for a silicon weapon. The polishing cushion includes a polishing surface in contact with the silicon weapon. At least one groove is provided on the polishing surface. When polishing the silicon wafer, the edge of the silicon wafer is at least partially above the groove. The polishing cushion, the polishing device and the silicon wafer polishing process according to this invention can reduce the polishing rate at the edge of the silicon wafer, while the polishing rate of the entire wafer remains essentially unchanged,improving the smoothness of the edge thickness of the silicon wafer as well as the production yield.
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