Transmon qubit flip-chip structures for quantum computing devices

• 1. 一种倒装芯片结构、制备方法及电子设备 [P] . 中国专利： CN114005921A . 2022-02-01
• 2. 一种倒装芯片的封装结构及电子设备 [P] . 中国专利： CN112166502A . 2021-01-01
• 3. Fabrication of transmon qubit flip-chip structures for quantum computing devices [P] . KR20220002559A . 2022-01-06

  机译： 用于量子计算装置的透射QUB倒装芯片结构的制造

• 4. FABRICATING TRANSMON QUBIT FLIP-CHIP STRUCTURES FOR QUANTUM COMPUTING DEVICES [P] . US2021111329A1 . 2021-04-15

  机译： 用于量子计算设备的透射QUB倒装芯片结构

• 5. Fabricating transmon qubit flip-chip structures for quantum computing devices [P] . US10944039B2 . 2021-03-09

  机译： 用于量子计算设备的透射QUB倒装芯片结构

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