首页> 外国专利> Plasma Etching Process Monitoring Device Using Machine Learning Model For Multi-channel Optical Emission Spectroscopy Analysis And Plasma Etching Process Monotoring Method Using The Same

Plasma Etching Process Monitoring Device Using Machine Learning Model For Multi-channel Optical Emission Spectroscopy Analysis And Plasma Etching Process Monotoring Method Using The Same

机译:等离子体蚀刻过程监测装置使用用于多通道光发射光谱分析的机器学习模型和等离子体蚀刻过程使用相同的方法

摘要

Plasma etching process diagnosis apparatus using machine learning model for multi-channel optical spectrum analysis that can predict the optimal etching end point time by extracting features from the optical data structure and processing the features with a machine learning classifier, and plasma etching process diagnostic method using the same This is initiated. The processor of the plasma etching process diagnosis apparatus of the present invention includes: an optical data collection unit for collecting real-time measured data from an optical sensor and storing the data in a database; a data processing unit that separates the data of the data collection unit into training data and test data by performing feature extraction in the feature extraction unit; and a data analysis unit in which the training data is learned by the machine learning classifier, and the training data and the test data are composed of etch endpoint data and non-end point data, respectively. According to the present invention, an optimal etch endpoint time can be predicted by extracting features from an optical data structure observed in real time and processing the features with a machine learning classifier.
机译:等离子体蚀刻工艺诊断装置使用机器学习模型进行多通道光谱分析,可以通过从光学数据结构提取特征并用机器学习分类器处理特征来预测最佳蚀刻终点时间,以及使用等离子体蚀刻过程诊断方法这是相同的。本发明的等离子体蚀刻处理诊断装置的处理器包括:光学数据收集单元,用于从光学传感器收集实时测量数据并将数据存储在数据库中;一种数据处理单元,其通过在特征提取单元中执行特征提取来将数据收集单元的数据分离为训练数据和测试数据;和数据分析单元,其中通过机器学习分类器学习训练数据,以及训练数据和测试数据分别由蚀刻端点数据和非结束点数据组成。根据本发明,可以通过从实时观察到的光学数据结构并用机器学习分类器处理特征来预测最佳蚀刻端点时间。

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