An adhesive composition capable of forming an adhesive layer (cured product) excellent in room temperature adhesiveness, moisture absorption solder heat resistance and low dielectric properties is provided. A long-chain polyimide (A) comprising, as a reaction component, a monomer group (α) comprising an aromatic tetracarboxylic anhydride (a1) and a dimer diamine (a2) and an aromatic tetracarboxylic anhydride (b1) and a dimer diamine (b2) It contains a short-chain polyimide (B) containing a monomer group (β) as a reactive component, a thermosetting crosslinking agent (C), and an organic solvent (D), on the other hand, the weight average molecular weight of component (A) (M (A) ) is 24000 or more and less than 45000 and the weight average molecular weight (M (B) ) of component (B) is 7000 or more and less than 24000, while satisfying the following conditions (1) and (2). 1.2 ≤ [M (A) / M (B) ] ≤ 3.5 1.5 ≤ [(A) content of component (W (A) ) / (B) content of component (W (B) ) ≤ 9
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