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Embedded network on chip accessible to programmable logic fabric of programmable logic device in multi-dimensional die systems
Embedded network on chip accessible to programmable logic fabric of programmable logic device in multi-dimensional die systems
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机译：可编程逻辑器件在多维模具系统中的可编程逻辑结构可访问的嵌入式片上网络
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摘要
An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die, such that the programmable logic fabric may include a first region of programmable logic fabric and a second region of programmable logic fabric. The first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data. The integrated circuit may also include network on chip (NOC) circuitry disposed on a second integrated circuit die, such that the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die.
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