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Die-level product modeling without die-level input data
Die-level product modeling without die-level input data
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机译:文明程度没有文明程度输入产品建模数据
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摘要
A machine learning model for each die to impute process control parameters from the die. The model is based on measurements of wafer alignment parameters at multiple test sites across the entire wafer and yield results for the wafer. This allows better analysis of outlier spatial patterns to improve yield results.
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