首页> 外国专利> Die-level product modeling without die-level input data

Die-level product modeling without die-level input data

机译:文明程度没有文明程度输入产品建模数据

摘要

A machine learning model for each die to impute process control parameters from the die. The model is based on measurements of wafer alignment parameters at multiple test sites across the entire wafer and yield results for the wafer. This allows better analysis of outlier spatial patterns to improve yield results.
机译:

著录项

相似文献

  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号