首页> 外文会议>10th International congress on thermal stresse >The Generalized 2D Thermal -electro-elastic Solution for the Cracked- Half-Elliptical-Hole Problem in a Half Plane
【24h】

The Generalized 2D Thermal -electro-elastic Solution for the Cracked- Half-Elliptical-Hole Problem in a Half Plane

机译:半平面裂纹半椭圆孔问题的广义二维热电弹性解

获取原文
获取原文并翻译 | 示例

摘要

In this paper,the half elliptical hole with an edge crack in a thermalpiezoelectric materials is studied,anda generalized 2D thermal-electro-elastic solution is derived by using the complex variable method.First,the mapping function which maps the outside of the elliptical hole and the crack in the right half planeinto the outside of a circular hole in a full plane is given by the method of conformal mapping.Then thecomplex potential functions for the temperature/mechanical/electric field,and the fields intensity factorsare presented based on the assumption that the surface of the crack and hole is adiabatic,electricallyimpermeable and traction-free,respectively.Numerical analysis is also made to discuss the influences ofthe crack length and the thermal/mechanical/electric loading on the fields intensity factors.Similar to thefull plane problem,some useful results can be found:the heat flux which perpendicular to the crack hasgreat effect on the stress intensity factors for the mode II cracks,but its influence on the stress intensityfactors for the mode I cracks and the intensity factors for the electric displacement is not significant.
机译:本文研究了热压电材料中带有边缘裂纹的半椭圆孔,并利用复变量方法推导了广义二维热电弹性解。首先,映射函数绘制了椭圆孔的外部然后采用保角映射的方法给出了全平面上圆孔外部的右半平面的裂纹。然后根据温度场,机械场,电场场的复势函数,提出了场强因子。裂纹和孔的表面分别是绝热的,不渗透电的和无牵引的。还通过数值分析讨论了裂纹长度和热/机械/电载荷对场强因子的影响。类似于全平面问题可以发现一些有用的结果:垂直于裂纹的热通量对模式II的应力强度因子有很大的影响裂纹,但它对I型裂纹应力强度因子和电位移强度因子的影响不显着。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号