首页> 外文会议>12th European microelectronics amp; packaging conference (IMAPS EUROPE '99) >HIGH DENSITY THICK FILM TECHNOLOGY FOR SENSOR APPLICATIONS
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HIGH DENSITY THICK FILM TECHNOLOGY FOR SENSOR APPLICATIONS

机译:用于传感器的高密度厚膜技术

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A medical pressure sensor in catheter form has been realised as a ceramic multichip module (MCM-C) with multilayer thick film technology. Due to the requirements for high density, low-cost, high quality and a high level of reliability for interconnection technology a diffusion patterning (Diffusion Patterning is a trade-mark of company Du Pont) technology for the ceramic multichip modules was chosen, tested and evaluated. Results of the test showed that a 400 μm pitch of lines and vias could be achieved with an acceptable yield and minimal modifications on standard product lines. It is estimated that with this technology complex hybrids can be built on 20% to 40% smaller substrates.rnThe medical pressure sensor in catheter form is of electronic design with a semi-custom ASIC for signal processing, a silicon piezoresistive pressure sensor as a sensing element, and 12 passive components for parameter adjustment and ASIC periphery. Based on the obtained results a low cost MCM with four conductive layers was realised. It integrates three bare dies bonded with aluminium wires, nine laser trimmed thick film resistors and two multilayer chip capacitors on a ceramic substrate (3.5 mm × 18.0 mm).
机译:导管形式的医疗压力传感器已经实现为采用多层厚膜技术的陶瓷多芯片模块(MCM-C)。由于互连技术对高密度,低成本,高质量和高可靠性的要求,因此选择,测试并选择了用于陶瓷多芯片模块的扩散图案化技术(Diffusion Patterning是杜邦公司的商标)。评估。测试结果表明,可以以可接受的良率和对标准产品线的最小改动实现线和通孔的400μm间距。据估计,利用该技术,可以在20%到40%的较小基板上构建复杂的混合体。rn导管形式的医疗压力传感器采用电子设计,具有用于信号处理的半定制ASIC,硅压阻式压力传感器作为传感元件。元件和12个无源元件用于参数调整和ASIC外围设备。基于所获得的结果,实现了具有四个导电层的低成本MCM。它在陶瓷基板(3.5 mm×18.0 mm)上集成了三个用铝线粘合的裸片,9个激光修整厚膜电阻器和两个多层片状电容器。

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