摘要：Wafer probe was once considered a method for saving packaging costs of bad die. Today, it's a critical elecment in process control, yield management, yield enhancement and customer quality--as well as overall cost of test. Moreover, full testing at wafer sort (probe), followed by testing for assembly-related failures at the package level, may not be far away.%晶圆测试探针曾被认为是节约废芯片封装成本的一种方法,现今它却成为工艺控制、成品率管理、产品质量以及总测试成本的一个关键因素.此外,随着组装相关的故障测试之后,封装水准晶圆分选的完全测试不久将会来临.
