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首页> 外文会议>2009 International Students and Young Scientists Workshop Photonics and Microsystems >Magnetron sputtering system with multi-targets for multilayers deposition
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Magnetron sputtering system with multi-targets for multilayers deposition

机译：具有多靶材的磁控溅射系统，用于多层沉积

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In this paper new magnetron sputtering system for multilayers deposition has been presented. The system allows sputtering of different materials from 4 targets in low pressure of working and reactive gas (oxygen, argon, oxygen + argon). Manufactured structures can be build from films, which have gradient concentration of dopant. Also the doping process can be performed with high precision in continuous or in pulse way. The high doping precision and possibility of deposition of multilayers without interruption of the sputtering process was received after application of a special designed magnetron pulse supplies. Thanks of that the system allows on manufacturing of the multilayers, which connect properties of different single films (dielectric, semiconducting and conducting) in one structure.
机译：在本文中，提出了一种用于多层沉积的新型磁控溅射系统。该系统允许在低压工作气体和反应气体（氧气，氩气，氧气+氩气）中溅射来自4个靶材的不同材料。制造的结构可以由具有梯度浓度的掺杂剂的薄膜制成。而且，可以以连续或脉冲方式高精度地执行掺杂工艺。在应用特殊设计的磁控管脉冲电源后，获得了很高的掺杂精度和多层沉积的可能性，而不会中断溅射过程。多亏了该系统，该系统才允许制造多层结构，该多层结构将一个结构中不同单层膜的特性（介电，半导体和导电）联系起来。

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