Compact electro-thermal modeling and simulation of large area multicellular Trench-IGBT

机译：大面积多孔Trench-IGBT的紧凑电热建模和仿真

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In this contribution we report on electro-thermal modeling and simulation strategy of large area multicellular Trench-IGBT (TIGBT). The proposed solution is based on two coupled systems: a 3D thermal simulator and a 1D electrical (with temperature dependent parameters) physical model of single TIGBT cell. The single cell electrical model has been calibrated to fit the experimental characteristics of a 1200Volt-1000Ampere commercial TIGBT and the influence on the breakdown behaviour of the second order effects has also been included. The unit cell model has been inserted in the 3D thermal simulator and the time dependent thermal maps have been obtained. As a final results we will present electro-thermal simulations in short-circuit condition; the latch-up onset of the parasitic thyristor will be analyzed.

机译：在此贡献中，我们报告了大面积多单元Trench-IGBT（TIGBT）的电热建模和仿真策略。提出的解决方案基于两个耦合系统：单个TIGBT单元的3D热仿真器和1D电气（具有与温度相关的参数）物理模型。已对单电池电模型进行了校准，以适应1200Volt-1000Ampere商业TIGBT的实验特性，并且还包括了对二阶效应的击穿行为的影响。已将晶胞模型插入3D热仿真器中，并获得了与时间有关的热图。作为最终结果，我们将介绍短路条件下的电热模拟。将分析寄生晶闸管的闩锁开始。

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来源
《2010 27th International Conference on Microelectronics Proceedings》|2010年|p.379-382|共4页
会议地点 Nis(RS);Nis(RS)
作者
Riccio M.; Carli M.; Rossi L.; Irace A.; Breglio G.; Spirito P.;
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Department of Biomedical Electronics and Telecommunications Engineering, University of Naples "Federico II" Via Claudio 21, 80125 Naples, Italy;

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正文语种 eng
中图分类微模组件;
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机译：混合动力电动汽车中IGBT模块快速电热仿真的精确热紧凑模型的提取
2. Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices [J] . Stefano de Filippis, Helmut Koeck, Michael Nelhiebel, Microelectronics & Reliability . 2012,第9a10期

机译：用于功率半导体器件电热仿真的高各向异性微观结构建模
3. Impact of device aging in the compact electro-thermal modeling of SiC power MOSFETs [J] . Ceccarelli L., Bahman A. S., Iannuzzo F. Microelectronics & Reliability . 2019,第Sepa期

机译：SIC电源MOSFET紧凑型电热模拟装置老化的影响
4. Compact Electro-thermal Modeling and Simulation of Large Area Multicellular Trench-IGBT [C] . M. Riccio, M. Carli, L. Rossi, International Conference on Microelectronics . 2010

机译：大面积多细胞沟 - IGBT的紧凑型电热模拟和仿真
5. A new simulation model of coupled electro-thermal performance for MOSFET devices. [D] . Kaytaz, V. Gunhan. 2005

机译：MOSFET器件电热性能耦合的新仿真模型。
6. Pannexin1 Drives Multicellular Aggregate Compaction via a Signaling Cascade That Remodels the Actin Cytoskeleton [O] . Brian A. Bao, Charles P. Lai, Christian C. Naus, 2012

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7. Results are presented for the first fully physical, time-dependent, coupled electro-thermal simulations of microwave power FETs and MMICs, on timescales suitable for CAD. This is achieved by combining an original, analytical thermal resis-tance matrix model of time-dependent heat flow in a power FET or MMIC, with a fully physical electrical CAD model for transistors. [O] . David S., Batty W., Panks A.J., 2000

机译：在适用于CAD的时标上，首次展示了微波功率FET和MMIC的完全物理的，与时间相关的耦合电热仿真结果。这是通过将功率FET或MMIC中随时间变化的热流的原始分析热阻矩阵模型与晶体管的完全物理电CAD模型相结合来实现的。
8. Thermal and Electro-Thermal Modeling and Simulation Techniques for Multichip Modules [R] . Rencz, M. K. , Szekely, V. , Kerecsen, I. 1998

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Compact electro-thermal modeling and simulation of large area multicellular Trench-IGBT

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