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Growth of Cu/Zn alloy films sputtered on flexible acrylic resin-coated PET substrates

机译:在柔性丙烯酸树脂涂层PET基底上溅射铜/锌合金膜的生长

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摘要

Cu/Zn alloy films were DC sputtered onto flexible acrylic resin-coated PET substrates and the effect of DC sputtering parameters on the morphology and growth rate of Cu/Zn alloy films were investigated. It was found that long sputtering time, low voltage and large target-to-substrate distance could lead to smooth and uniform films. Chamber pressure should be well controlled. High voltage, short target-to-substrate distance and media chamber pressure could improve the growth rate of Cu/Zn alloy films. The suitable DC sputtering condition was voltage 1.6kV, target-to-substrate distance 25mm, chamber pressure 10Pa and sputtering time 20min, under which the as-prepared Cu/Zn alloy films possessed of smooth surface and uniform thickness of 41nm.
机译:将铜/锌合金薄膜直流溅射到柔性丙烯酸树脂包覆的PET衬底上,研究了直流溅射参数对铜/锌合金薄膜的形貌和生长速率的影响。结果发现,较长的溅射时间,低电压和较大的靶与基片之间的距离可导致形成光滑均匀的膜。腔室压力应得到良好控制。高电压,较短的目标到基板距离和介质腔压力可以提高Cu / Zn合金膜的生长速率。合适的直流溅射条件为电压1.6kV,靶至基板距离25mm,腔室压力10Pa和溅射时间20min,在此条件下,制得的Cu / Zn合金膜表面光滑,厚度均匀,为41nm。

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