首页> 外文会议>2013 IEEE International Conference of Electron Devices and Solid-State Circuit >Characteristics of submicron-footprint TiO2 based AlGaN/GaN MOSHEMT on SiC substrate
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Characteristics of submicron-footprint TiO2 based AlGaN/GaN MOSHEMT on SiC substrate

机译:SiC衬底上亚微米级TiO2基AlGaN / GaN MOSHEMT的特性

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AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) with thick (>30 nm), high-κ (TiO2/NiO), submicron-footprint (0.4 µm) gate dielectric on SiC substrate are demonstrated, which are found to exhibit low gate leakage current (∼ 1 nA/mm of gate periphery), high IMAX (1 A/mm), and high drain breakdown voltage (188 V). The derived current gain cutoff frequency is 30 GHz (from S-parameter measurements). The output power density is 6.6 W/mm, and the associated power-added-efficiency is 46% at 2.5 GHz frequency and 50 V drain bias. This high performance submicron-footprint MOSHEMT is highly promising for microwave power amplifier applications in communication and radar systems.
机译:AlGaN / GaN金属氧化物半导体高电子迁移率晶体管(MOSHEMT),具有厚(> 30 nm),高κ(TiO 2 / NiO),亚微米封装(0.4 µm)栅极电介质演示了SiC衬底,发现它具有较低的栅极漏电流(约1 nA / mm的栅极周边),较高的I MAX (1 A / mm)和较高的漏极击穿电压(188 V) )。导出的电流增益截止频率为30 GHz(根据S参数测量)。在2.5 GHz频率和50 V漏极偏置下,输出功率密度为6.6 W / mm,相关的功率附加效率为46%。这种高性能的亚微米级MOSHEMT在通信和雷达系统中的微波功率放大器应用中非常有前途。

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