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首页> 外文会议>2014 8th International Conference on Integrated Power Systems >Influence of nickel-phosphorus surface roughness on both wettability and pores formation in solder joints for high power electronic applications
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Influence of nickel-phosphorus surface roughness on both wettability and pores formation in solder joints for high power electronic applications

机译：镍-磷表面粗糙度对大功率电子应用中焊点的润湿性和气孔形成的影响

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摘要

Electroless nickel-high-phosphorus Ni-P plating is used as substrate coating in the electronic component technology. The ability to minimize pores formation in solder joints and the wettability of the Ni-P layer remain points of investigation. The qualities and the control of the physical and chemical properties of the deposits are essential for the reliability of the products. In this contribution it has been measured how a controlled change of one property of the Ni-P surface, its average roughness, changes the wettability of this surface before soldering completion, at ambient temperature and under ambient air, and how it contribute to change the amount and size of pores inside solder joints, after soldering completion. Before all, observations of the Ni-P surfaces using scanning electron microscopy have been achieved. Then the wettability has been measured through the determination of both the disperse and the polar fractions of the substrate surface tension, based on the measurements of the wetting angle for droplets of four different liquids, under ambient air and at room temperature (classical sessile drop technique). Finally the X-Ray micro-radiography measurements of both the area fraction of pores and the size of the largest pore inside the solder joint of dice laser soldered on the studied substrate, using high melting temperature solder (300deg C, PbSnAg) have been achieved. This study clearly demonstrates that both the ability to minimize pores formation in solder joints and the wettability under ambient conditions of the Ni-P substrate decrease and become more variable when its average roughness increases.
机译：化学镀镍-高磷Ni-P用作电子组件技术中的基底涂层。最小化焊点中的孔形成的能力以及Ni-P层的润湿性仍然是研究的重点。沉积物的质量和物理化学性质的控制对于产品的可靠性至关重要。在这一贡献中，已测量出在室温和环境空气中，Ni-P表面的一种性能，其平均粗糙度，其平均粗糙度如何在焊接完成之前如何受控地改变该表面的润湿性，以及它如何有助于改变镍磷表面的润湿性。焊接完成后，焊点内孔的数量和大小。以前，已经实现了使用扫描电子显微镜对Ni-P表面的观察。然后，根据在环境空气和室温下四种不同液体的液滴的润湿角的测量结果，通过确定基材表面张力的分散度和极性分数来测量润湿性（经典无滴法） ）。最后，通过使用高熔点温度的焊料（300℃，PbSnAg），完成了在所研究的基板上激光焊接的骰子的焊点内部的孔的面积分数和最大孔的大小的X射线显微照相测量。 。这项研究清楚地表明，最小化焊点中的孔形成的能力以及在Ni-P衬底的环境条件下的润湿性都会降低，并且当其平均粗糙度增加时，其可变性会更大。

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