• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, 16th International Conference on Electronic Materials and packaging >A comparison study for metalized ceramic substrate technologies: For high power module applications
【24h】

A comparison study for metalized ceramic substrate technologies: For high power module applications

机译：金属化陶瓷基板技术的比较研究：适用于大功率模块应用

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

In the recent few years, high power electronic becomes one of the fastest growing market segments of semiconductor industry, because of the strong demand of high energy conversion efficiency and low energy loss, for the green environment protection. The major applications are motor drivers, UPS, PV inverters, hybrid/electric vehicle, rail traction and wind turbines...etc. Those applications are typically operating at very high voltage (> 200V) and high current (> 50A), and also need to operate under high temperature and harsh environment. Therefore, the circuit boards for such applications must achieve outstanding characteristics in terms of electrical, thermal, and mechanical performance, in order to provide reliable functionality during operation. Ceramics are no doubt the unique material that can offer excellent performance to survive at such operation conditions, and can be used as the core material of the circuit board for power modules. Therefore, in order to further understand the advantages and disadvantages of each ceramic technology, such as DBC, DPC, and thick film substrates, a comprehensive comparison study on reliability, thermal, and electrical performance were discussed.
机译：近年来，由于对绿色环保的高能量转换效率和低能量损耗的强烈需求，高功率电子成为半导体工业增长最快的市场部分之一。主要应用是电动机驱动器，UPS，PV逆变器，混合动力/电动汽车，铁路牵引和风力涡轮机等。这些应用通常在非常高的电压（> 200V）和大电流（> 50A）下运行，并且还需要在高温和恶劣的环境下运行。因此，用于此类应用的电路板必须在电气，热学和机械性能方面达到出色的特性，以便在运行期间提供可靠的功能。毫无疑问，陶瓷是一种独特的材料，可以在这种工作条件下保持出色的性能，并且可以用作功率模块电路板的核心材料。因此，为了进一步了解DBC，DPC和厚膜基板等每种陶瓷技术的优缺点，对可靠性，热性能和电性能进行了全面的比较研究。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号