Mechanical property analyses on power diodes in a typical 5W adapter

著录项

• 来源
  《2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, 16th International Conference on Electronic Materials and packaging》|2014年|454-457|共4页
• 会议地点 Taipei(CT)
• 作者

  Zhong-Yi Wu; Pei-Hsuan Wu; Hu Annie; Kao Jeff; Lee Robert; Chen Richard; Chung Harrison; Ben-Je Lwo;

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• 作者单位

  Dept. of Mechatron., Energy Aerosp. Eng., Nat. Defense Univ., Taichung, Taiwan;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  finite element analysis; power semiconductor diodes; semiconductor device packaging; temperature distribution; thermal management (packaging); thermal stresses; ANSYS FEM software; boundary conditions; diode packaging; equivalent material property equations; global-local methodology; mechanical property analyses; power 5 W; power adapter; power diodes; temperature distribution measurements; thermal stress analyses; thermo-stress analyses; Adaptation models; Bridges; Finite element analysis; Packaging; Schottky diodes;

  机译：有限元分析;功率半导体二极管;半导体器件封装;温度分布;热管理（封装）;热应力; ANSYS FEM软件;边界条件;二极管封装;等效材料性能方程式;全局-局部方法;力学性能分析;功率5 W;电源适配器;功率二极管;温度分布测量;热应力分析;热应力分析;适应模型;桥梁;有限元分析;包装;肖特基二极管;