An optimization model of the stripline-to-stripline vertical interconnect in LTCC technology

机译：LTCC技术中带状线与带状线垂直互连的优化模型

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This paper presents a microwave stripline-to-stripline vertical interconnect in Low Temperature Co-fired Ceramic (LTCC) Technology. Two circular grooves are separately designed in the stripline lower ground plane and the stripline upper ground plane to reduce the insertion loss and improve the return loss. The mentioned structure has been simulated by HFSS. According to the simulation comparison results, the insertion loss can reduce 0.04 dB on average and the return loss can increase 17.5 dB on average over a band from 0.3 Ghz to 30 Ghz.

机译：本文介绍了一种采用低温共烧陶瓷（LTCC）技术的微波带状线至带状线垂直互连。带状线下部接地平面和带状线上部接地平面中分别设计了两个圆形凹槽，以减少插入损耗并提高回波损耗。所提及的结构已通过HFSS模拟。根据仿真比较结果，在从0.3 Ghz到30 Ghz的频带上，插入损耗平均可减少0.04 dB，回波损耗平均可增加17.5 dB。

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来源
《2014 IEEE International Conference on Communication Problem-Solving》|2014年|12-13|共2页
会议地点 Beijing(CN)
作者
Yupeng Liu; Lei Xia; Ruimin Xu;
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作者单位

Fundamental Sci. on EHF Lab., Univ. of Electron. Sci. Technol. of China, Chengdu, China;

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原文格式 PDF
正文语种 eng
中图分类
关键词
LTCC; circular aperture; microstrip; stripline-to-stripline; vertical interconnect;

机译：LTCC;圆形孔径;微带;带状线至带状线;垂直互连;

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1. High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications [J] . Decrossas Emmanuel, Glover Michael D., Porter Kaoru, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2015,第3期

机译：适用于多芯片模块和系统级封装应用的高性能和高数据速率准同轴LTCC垂直互连过渡
2. LTCC-BASED VERTICAL VIA INTERCONNECTS FOR RF MEMS PACKAGING [J] . Yong-Seung Bang, Jung-Mu Kim, Jong-Man Kim, Microwave and optical technology letters . 2010,第2期

机译：基于LTCC的垂直VIA互连，用于RF MEMS包装
3. 35-GHz Wideband Vertical Off-Center-Fed Dipole and Its Array in LTCC Technology [J] . M. Du, J. Xu, X. Ding, Radioengineering . 2018,第1期

机译：LTCC技术中的35 GHz宽带垂直偏心馈电偶极子及其阵列
4. An optimization model of the stripline-to-stripline vertical interconnect in LTCC technology [C] . Yupeng Liu, Lei Xia, Ruimin Xu IEEE International Conference on Communication Problem-Solving . 2014

机译：LTCC技术中带状线垂直互连的优化模型
5. A multi-software modeling technique for field distribution propagation through an optical vertical interconnect assembly. [D] . Howard, Matthew D. 2011

机译：一种用于通过光学垂直互连组件传播场分布的多软件建模技术。
6. Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology [O] . Sten Vollebregt, Ryoichi Ishihara 2015

机译：兼容半导体技术的低温碳纳米管垂直互连件的制造
7. LTCC interconnect modeling by support vector regression [O] . L. Xia, R. Xu, B. Yan 2014

机译：通过支持向量回归建立LTCC互连建模

An optimization model of the stripline-to-stripline vertical interconnect in LTCC technology

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