High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications

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• 来源
  《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 |2015年第3期|307-313|共7页
• 作者

  Decrossas Emmanuel; Glover Michael D.; Porter Kaoru; Cannon Tom; Stegeman Thomas; Allen-McCormack Nicholas; Hamilton Michael C.; Mantooth H. Alan;

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• 作者单位

  High Density Electronics Center, University of Arkansas, Fayetteville, AR, USA;

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• 收录信息
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  Bit error rate; Connectors; Fabrication; Frequency measurement; Stripline; Time-domain analysis; Transmission line measurements; Full tape thickness feature; low-temperature cofired ceramic (LTCC) interconnect; multichip module (MCM); quasi-coaxial vertical transition; signal integrity; system on package; system on package.;

  机译：误码率;连接器;制造;频率测量;带状线;时域分析;传输线测量;整条带厚度特征;低温共烧陶瓷（LTCC）互连;多芯片模块（MCM）;准同轴垂直过渡;信号完整性;包装上的系统;包装上的系统;